Prepreg 7628: High-Performance Glass-Epoxy Composite for Advanced PCB Manufacturing

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prepreg 7628

Prepreg 7628 is a high-performance composite material consisting of woven E-glass fabric pre-impregnated with epoxy resin. This advanced material features a standardized glass fabric style of 7628, which provides exceptional strength and stability for electronic applications. The material is specifically engineered with a controlled resin content and precise thickness, making it ideal for multilayer printed circuit board (PCB) manufacturing. The prepreg 7628 exhibits excellent dimensional stability, superior electrical insulation properties, and remarkable mechanical strength. Its unique construction allows for consistent resin flow during lamination processes, ensuring optimal bonding between circuit layers. The material maintains its integrity across a wide range of temperatures and operating conditions, making it particularly suitable for high-reliability electronic applications. With its balanced weave pattern and uniform resin distribution, prepreg 7628 delivers consistent performance in terms of dielectric properties and thermal resistance. This material has become a standard in the electronics industry, particularly in applications requiring high-speed signal transmission and thermal management capabilities. Its versatility extends to various industrial applications, from consumer electronics to aerospace and telecommunications equipment.

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Prepreg 7628 offers numerous advantages that make it an exceptional choice for electronic manufacturing applications. First, its pre-impregnated nature ensures consistent resin content throughout the material, eliminating the variability often encountered with traditional glass fabric materials. This uniformity translates to reliable performance and predictable manufacturing outcomes. The material's excellent dimensional stability helps maintain precise circuit patterns and prevents warping during thermal cycling, which is crucial for maintaining the integrity of complex multilayer PCB designs. The balanced weave structure of the 7628 style glass fabric provides superior handling characteristics and prevents distortion during the lamination process. Additionally, the material exhibits outstanding electrical properties, including low dielectric constant and loss tangent, which are essential for high-frequency applications. The controlled resin content ensures optimal flow during lamination, creating strong interlayer adhesion while maintaining consistent thickness across the board. From a manufacturing perspective, prepreg 7628 offers excellent machinability and can be easily processed using standard PCB fabrication equipment. The material's thermal resistance makes it suitable for lead-free soldering processes, while its flame-retardant properties meet various international safety standards. The combination of mechanical strength and electrical performance makes it an ideal choice for applications requiring both structural integrity and reliable signal transmission.

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prepreg 7628

Superior Electrical Performance

Superior Electrical Performance

Prepreg 7628 stands out for its exceptional electrical characteristics, particularly in high-frequency applications. The material's carefully controlled dielectric properties ensure consistent signal transmission across a wide frequency range. The uniform resin distribution and balanced glass weave pattern minimize signal loss and impedance variations, which is crucial for maintaining signal integrity in high-speed digital circuits. The material's low dielectric constant helps reduce signal propagation delays, while its controlled loss tangent minimizes signal attenuation. These properties make it particularly valuable in applications where precise signal timing and minimal interference are essential. The material's excellent insulation resistance and breakdown voltage characteristics provide an added layer of reliability for high-voltage applications.
Enhanced Thermal Management

Enhanced Thermal Management

The thermal management capabilities of prepreg 7628 are engineered to meet the demanding requirements of modern electronic devices. The material's glass fabric construction, combined with its optimized resin system, provides excellent heat dissipation properties. This thermal stability is maintained across a wide temperature range, making it suitable for applications exposed to significant thermal cycling. The material's coefficient of thermal expansion is carefully controlled to match common copper circuitry, reducing stress on circuit traces and preventing delamination under thermal load. The high glass transition temperature ensures dimensional stability even at elevated operating temperatures, while the flame-retardant properties provide an additional safety margin.
Manufacturing Efficiency and Reliability

Manufacturing Efficiency and Reliability

Prepreg 7628 delivers significant manufacturing advantages that translate directly to improved production efficiency and yield. The material's consistent resin content and uniform thickness eliminate the need for complex process adjustments during lamination. Its excellent handling characteristics reduce the risk of damage during layup and processing, while the controlled flow properties ensure proper filling of circuit features during lamination. The material's compatibility with standard PCB processing equipment means no special tooling or equipment modifications are required. The predictable behavior during drilling and machining operations results in clean holes and edges, reducing post-processing requirements. Additionally, the material's storage stability and reasonable shelf life help minimize waste and ensure consistent quality throughout the manufacturing process.